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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Wei-Ming Cheng

This inventor holds 16 USPTO granted patents and 5 published patent applications and 1 EPO patent. Top assignee: Unimicron Technology Corporation. Active years: 2011-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Ming Cheng. Retrieved from https://idiyas.com/inventor/wei-ming-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 

% Patents Active = 75.0

 

Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 50(Granted Patents)


Company Filing History:

goldMedal16 out of 521 
 
Unimicron Technology Corporation
 patents

Years Active: 2011-2018

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16 patents (USPTO):Explore Patents
1. 10080284 - Circuit board structure (2018-09-18),
2. 9913418 - Process of an embedded component structure (2018-03-06),
3. 9860984 - Circuit board structure and manufacturing method thereof (2018-01-02),
4. 9832873 - Circuit board structure (2017-11-28),
5. 9609746 - Circuit board structure and manufacturing method thereof (2017-03-28),
6. 9370107 - Embedded component structure and process thereof (2016-06-14),
7. 9324664 - Embedded chip package structure (2016-04-26),
8. 9320143 - Touch member and method of manufacturing the same (2016-04-19),
9. 8803310 - Embedded electronic device package structure (2014-08-12),
10. 8736033 - Embedded electronic device package structure (2014-05-27),
11. 8729397 - Embedded structure (2014-05-20),
12. 8273651 - Method for fabricating wiring structure of wiring board (2012-09-25),
13. 8273256 - Method for manufacturing wiring structure of wiring board (2012-09-25),
14. 8191248 - Method for making an embedded structure (2012-06-05),
15. 8132321 - Method for making embedded circuit structure (2012-03-13),

Title: Innovations of Wei-Ming Cheng

Introduction

Wei-Ming Cheng is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of 16 patents. His work focuses on enhancing the functionality and efficiency of electronic components.

Latest Patents

One of his latest patents is a circuit board structure that includes an inner circuit structure and a first build-up circuit structure. This innovative design features a core layer with an upper and lower surface, along with patterned circuit layers and conductive through holes that connect them. Another notable patent involves a process for an embedded component structure, which details a wiring board with an opening that connects the front and reverse sides. This design allows for components to be bonded effectively, ensuring optimal electrical function.

Career Highlights

Wei-Ming Cheng is currently employed at Unimicron Technology Corporation, where he continues to develop cutting-edge technologies in circuit board design. His expertise has positioned him as a key player in the industry, contributing to advancements that benefit various electronic applications.

Collaborations

Throughout his career, Wei-Ming Cheng has collaborated with talented individuals such as Shu-Sheng Chiang and Tsung-Yuan Chen. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Wei-Ming Cheng's contributions to circuit board technology exemplify the spirit of innovation. His patents reflect a commitment to improving electronic components, making him a valuable asset in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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