The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Mar. 13, 2013
Unimicron Technology Corp., Taoyuan, TW;
Yu-Chen Chuo, New Taipei, TW;
Wei-Ming Cheng, Kaohsiung, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
An embedded-electronic-device package includes a core layer, an electronic device, a first dielectric layer, a second dielectric layer, a shielding-metal layer and conductive vias. The core layer includes a first surface, a second surface opposite to the second surface and a cavity penetrating the core layer. The electronic device is disposed in the cavity including an inner surface. The first dielectric layer disposed on the first surface is filled in part of the cavity and covers part of the electronic device. The second dielectric layer disposed on the second surface is filled in rest of the cavity, covers rest of the electronic device. The first and second dielectric layers cover the electronic device. The shielding-metal layer covers the inner surface. The conductive vias are respectively disposed in the first and second dielectric layers and extended respectively from outer surfaces of the first and second dielectric layers to the shielding-metal layer.