The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2012

Filed:

Aug. 13, 2008
Applicants:

Yi-chun Liu, Taipei County, TW;

Wei-ming Cheng, Kaohsiung, TW;

Tsung-yuan Chen, Taoyuan County, TW;

Shu-sheng Chiang, Taipei, TW;

Inventors:

Yi-Chun Liu, Taipei County, TW;

Wei-Ming Cheng, Kaohsiung, TW;

Tsung-Yuan Chen, Taoyuan County, TW;

Shu-Sheng Chiang, Taipei, TW;

Assignee:

Unimicron Technology Corp., Kwei-San Industrial Zone, Taoyuan, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.


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