The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Feb. 08, 2013
Unimicron Technology Corp., Taoyuan, TW;
Yu-Chen Chuo, New Taipei, TW;
Wei-Ming Cheng, Kaohsiung, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
An embedded electronic device package structure includes a core layer, an electronic device, a first dielectric layer, a second dielectric layer and conductive vias. The core layer has cavity, a first surface and a second surface opposite to the first surface. The electronic device is disposed in the cavity. The first dielectric layer disposed on the first surface is filled in part of the cavity and covers one side of the electronic device. The second dielectric layer disposed on the second surface is filled in the cavity, covers another side of the electronic device and connects the first dielectric layer. The first and the second dielectric layers fully cover the electronic device. The conductive vias are disposed around the surrounding of the electronic device and penetrates through the first and the second dielectric layer and the core layer. The conductive vias respectively connects the first and the second dielectric layer.