Tainan, Taiwan

Wei-Chih Weng


Average Co-Inventor Count = 5.4

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2014-2025

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8 patents (USPTO):

Title: Innovations of Wei-Chih Weng

Introduction

Wei-Chih Weng is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of seven patents. His work primarily focuses on integrated chip structures and interconnect technologies.

Latest Patents

Wei-Chih Weng's latest patents include a method for forming an integrated chip structure. This method involves creating a first dielectric bonding layer over a dielectric structure on a substrate, which surrounds multiple interconnects. The process includes patterning the bonding layer to expose interconnects and forming conductive bonding segments within recesses. Another notable patent describes an integrated chip structure that features a bonding structure between two dielectric structures, with an inter-tier interconnect structure extending through the substrate.

Career Highlights

Wei-Chih Weng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative work has contributed to advancements in chip design and manufacturing processes.

Collaborations

Wei-Chih Weng has collaborated with notable colleagues, including Hsun-Ying Huang and Jeng-Shyan Lin. Their teamwork has fostered a productive environment for innovation and development in semiconductor technologies.

Conclusion

Wei-Chih Weng's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in integrated chip structures and interconnect technologies.

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