Vincent Hool is a prominent inventor based in Pleasanton, CA (US), known for his significant contributions to the field of integrated circuit packaging. With a total of 10 patents to his name, Hool has made remarkable advancements that have influenced the technology industry.

Latest Patents

One of Hool's latest patents is an integrated circuit package with active warpage control printed circuit board mount. This innovative design includes a package substrate with a surface, featuring first interconnects arranged in a circular shape centered on the substrate. Additionally, second interconnects of a different size are arranged in a concentric ring shape, enhancing the functionality of the package. Another notable patent is the coreless organic substrate, which incorporates mounting holes near each corner to secure the substrate during assembly processes, preventing flexing.

Career Highlights

Hool has built a successful career at Altera Corporation, where he has been instrumental in developing cutting-edge technologies. His work has not only advanced the capabilities of integrated circuits but has also paved the way for future innovations in the field.

Collaborations

Throughout his career, Hool has collaborated with talented individuals such as Jon M Long and Hong Shi. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Vincent Hool's contributions to the field of integrated circuit packaging demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving the efficiency and functionality of electronic components.

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