The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Jan. 21, 2004
Vincent Hool, Fremont, CA (US);
Vincent Hool, Fremont, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also provides a semiconductor device package incorporating this heat spreader. In addition, fabrication methods for such heat spreaders and packages are provided. Generally, the heat spreaders and packages of the present invention include an embedded bypass capacitor that can provide decoupling capacitance in order to deliver near instant power to the die and/or minimize SSN. In a preferred embodiment, the embedded bypass capacitor is connected to terminals integrated with the heat spreader (e.g., lid; stiffener) and/or to a package plane (e.g., power plane or ground plane) in the package substrate for connection via the flip chip package's power delivery system to a power source and/or component.