The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Aug. 25, 2006
Applicants:
Vincent Hool, Pleasanton, CA (US);
Hong Shi, Santa Rosa, CA (US);
Yuanlin Xie, Fremont, CA (US);
Tarun Verma, Fremont, CA (US);
Inventors:
Vincent Hool, Pleasanton, CA (US);
Hong Shi, Santa Rosa, CA (US);
Yuanlin Xie, Fremont, CA (US);
Tarun Verma, Fremont, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A Ball Grid Array (BGA) integrated circuit package having (i) an additional dedicated ground ring on the package substrate which provides a reduced area return current loop path to reduce wire bond inductance; and/or (ii) ground wires positioned between adjacent input/output wires on the substrate which provide additional transient current paths among the input/output wires for improved characteristic impedance and cross talk control.