The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Jul. 25, 2014
Altera Corporation, San Jose, CA (US);
Vincent Hool, Pleasanton, CA (US);
Minghao Shen, San Jose, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
Integrated circuit packages with enhanced thermal conduction are disclosed. A disclosed integrated circuit package includes a package substrate. An integrated circuit die with a layer of metal on its backside is mounted on the package substrate at a first temperature (e.g., reflow temperature). The package further includes a heat spreading lid that is bonded to the integrated circuit die at a second temperature, which is less than the first temperature. The heat spreading lid is formed over the integrated circuit die in which the heat spreading lid makes physical contact with the integrated circuit die via the layer of metal.