Austin, TX, United States of America

Victoria Jean Bruce

This inventor holds 26 USPTO granted patents and 1 published patent application, primarily in Semiconductor Analysis. Top assignees: Advanced Micro Devices Corporation, Advance Micro Devices, Inc., Other. Active years: 1994-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Victoria Jean Bruce. Retrieved from https://idiyas.com/inventor/victoria-jean-bruce

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 76.9

Average Co-Inventor Count = 2.5

ph-index = 8

Forward Citations = 524(Granted Patents)


Company Filing History:


Years Active: 1994-2016

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Areas of Expertise:
3D Imaging
Tomography
Resistivity Analysis
Integrated Circuit
Fiber Optic
Laser Scribing
Semiconductor Device
Emission Microscopy
Endpoint Detection
Functional Failures
Current Paths
Photodiode Detection
26 patents (USPTO):Explore Patents

Title: Victoria Jean Bruce: Innovator in 3D Imaging Technology

Introduction: Victoria Jean Bruce, located in Austin, TX, has made significant contributions to the field of imaging technologies, holding a remarkable 26 patents. Her innovative work focuses mainly on enhancing imaging methods and defect analysis in semiconductor devices, utilizing cutting-edge techniques to improve efficiency and accuracy.

Latest Patents: Among her latest patents, Victoria has developed groundbreaking technologies such as "3D imaging with multiple irradiation frequencies." This method utilizes different irradiation frequencies to generate a composite three-dimensional image of semiconductor devices. The process entails irradiating the device with two distinct frequencies, capturing the respective radiation responses, and combining these responses to create an accurate composite image.

Another noteworthy patent is her development of "Three-dimensional tomography." This invention enhances defect analysis by allowing the viewing of spatial manifestations of defects from virtually any angle. The innovative process involves removing substrate from a semiconductor die while simultaneously capturing images of the die portions. These images, recorded at various points during substrate removal, are integrated to form a comprehensive 3D image for detailed defect analysis.

Career Highlights: Throughout her career, Victoria Jean Bruce has worked with reputable companies, including Advanced Micro Devices Corporation, where her contributions have significantly advanced the company’s technological capabilities in imaging and semiconductor technologies.

Collaborations: Victoria has collaborated with notable individuals in the industry, including Michael R. Bruce and Rosalinda M. Ring. Together, they have worked on various projects aimed at enhancing imaging technologies and semiconductor defect analysis.

Conclusion: Victoria Jean Bruce's innovative spirit and technical expertise have positioned her as a leading figure in the field of 3D imaging technologies. With her extensive portfolio of patents and valuable contributions to established companies, she continues to shape the future of semiconductor imaging and diagnostics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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