The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2003
Filed:
Aug. 26, 1999
Applicant:
Inventor:
Victoria J. Bruce, Austin, TX (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/126 ;
U.S. Cl.
CPC ...
G01R 3/126 ;
Abstract
A semiconductor device is manufactured and tested post-manufacture using a probe point extending into the backside of a flip-chip device. During manufacture, a trench is formed in a portion of the backside of the device. At least a portion of the trench is filled with conductive material to provide a probe. After the device is manufactured, circuitry adjacent the probe point is tested. The testing includes milling the backside of the semiconductor device to access the probe, and then coupling energy from the probe to acquire a waveform.