The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2005
Filed:
Apr. 19, 2001
Glen P. Gilfeather, Del Valle, TX (US);
Srikar V. Chunduri, Austin, TX (US);
Brennan V. Davis, Austin, TX (US);
David H. Eppes, Austin, TX (US);
Victoria Bruce, Austin, TX (US);
Michael Bruce, Austin, TX (US);
Rosalinda M. Ring, Austin, TX (US);
Daniel Stone, Austin, TX (US);
Glen P. Gilfeather, Del Valle, TX (US);
Srikar V. Chunduri, Austin, TX (US);
Brennan V. Davis, Austin, TX (US);
David H. Eppes, Austin, TX (US);
Victoria Bruce, Austin, TX (US);
Michael Bruce, Austin, TX (US);
Rosalinda M. Ring, Austin, TX (US);
Daniel Stone, Austin, TX (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
The operability of light-based semiconductor die analysis is enhanced using a method and arrangement that directs light between a light source and a die. In one example embodiment of the present invention, a light source is directed to a die in a semiconductor analysis arrangement using a fiber optic cable. The analysis arrangement is adapted to use light received via the fiber optic cable to analyze the die. The analysis includes one or more light-based applications, such as stimulating a selected portion of the die with the light and detecting a response therefrom. In this manner, light can be directed to a die in a variety of analysis implementations, such as for analyzing a die in a test chamber.