Company Filing History:
23 out of 826 
1 out of 832,966 Years Active: 2001-2007
Title: Tzong-Da Ho: A Pioneer in Semiconductor Packaging Innovations
Introduction
Tzong-Da Ho is an esteemed inventor based in Taichung, Taiwan, known for his significant contributions to the field of semiconductor packaging. With a remarkable portfolio of 24 patents, he has demonstrated a relentless pursuit of innovation.
Latest Patents
Among his latest patents, Tzong-Da Ho has developed noteworthy methods for enhancing semiconductor packages. One such patent details a method of making a semiconductor package with a heat spreader. This innovative approach involves a chip carrier module plate with a multitude of array-arranged chip carriers, each mounted with at least one chip. A heat spreader module plate is affixed to the chips, featuring an interface layer that optimizes adhesion properties, ensuring effective encapsulation and heat dissipation.
Another notable patent is his fabrication method for a semiconductor package with a heat sink. This invention allows the chip's first surface to be secured to a chip carrier, while the second surface attaches to a heat sink using an adhesive. This design facilitates efficient heat transfer from the chip to the heat sink, with external exposure allowing for optimal heat dissipation. Additionally, the coating on the heat sink's top surface mitigates potential delamination and cracking during the molding process, showcasing Tzong-Da's commitment to refining thermal management solutions in semiconductor technology.
Career Highlights
Throughout his career, Tzong-Da Ho has been involved with notable companies, including Siliconware Precision Industries Co., Ltd. His work in these industries has provided him with a robust platform to innovate and patent his groundbreaking ideas.
Collaborations
Tzong-Da has collaborated with several distinguished colleagues, including Chien-Ping Huang and Cheng-Hsu Hsiao. These collaborations have fostered an environment of creativity and technical advancement, leading to their collective success in the semiconductor field.
Conclusion
Tzong-Da Ho's impressive array of patents reflects his dedication to the evolution of semiconductor packaging technology. His innovative methods not only enhance the efficiency of semiconductor packages but also position him as a vital player in advancing this critical sector. With ongoing contributions and collaborations, Tzong-Da Ho continues to shape the future of semiconductor innovations.