The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2004
Filed:
Sep. 05, 2001
Abstract
A fabricating method for a semiconductor package is proposed, in which a chip carrier accommodates at least one semiconductor chip, which is attached with an interface layer formed on a covering module plate consisting of at least one covering plate, while the interface layer is poor in adhesion to the chip and a molding compound used for forming an encapsulant. So that after completing molding, ball implantation and singulation processes, the interface layer, the covering plate and a portion of the encapsulant formed on the covering plate can be easily removed by heating the singulated semiconductor package. This allows the molding compound not to flash on the chip, and prevents the chip from being damaged by stress generated in the molding process.