Company Filing History:
Years Active: 2002-2004
Title: Innovations by Inventor Chen-Hsu Hsiao
Introduction
Chen-Hsu Hsiao is a notable inventor based in Nantou, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approaches. His work focuses on improving the efficiency and reliability of semiconductor packages.
Latest Patents
One of his latest patents is a fabricating method for a semiconductor package. This method involves a chip carrier that accommodates at least one semiconductor chip, which is attached with an interface layer formed on a covering module plate. The interface layer is designed to have poor adhesion to the chip and the molding compound used for forming an encapsulant. This design allows for easy removal of the interface layer, covering plate, and a portion of the encapsulant by heating the singulated semiconductor package. This innovation prevents damage to the chip during the molding process.
Another patent by Hsiao proposes a substrate of a semiconductor package. This substrate features a strip copper layer on a core layer, with a solder mask covering the core layer and two lengthwise sides of the copper layer. The design includes a groove that exposes a surface between the sides of the copper layer, which is plated with gold. This configuration allows for effective clamping during the encapsulation process and facilitates the easy removal of encapsulating resin without damaging the substrate.
Career Highlights
Chen-Hsu Hsiao is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has significantly impacted the efficiency of semiconductor packaging processes.
Collaborations
He has collaborated with notable coworkers, including Chien-Ping Huang and Tzong-Da Ho, contributing to advancements in their field.
Conclusion
Chen-Hsu Hsiao's contributions to semiconductor packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work not only enhances the efficiency of semiconductor packages but also ensures the reliability of electronic devices.