The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2004
Filed:
Dec. 20, 2001
Applicant:
Inventors:
Chien-Ping Huang, Taichung, TW;
Tzong-Da Ho, Taichung, TW;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A semiconductor package with a crack-preventing member is proposed, in which a chip is mounted on a chip carrier by means of an adhesive and is electrically connected to the chip carrier. The crack-preventing member is formed at a proper position on the chip, and generates compression stress on the chip to sufficiently counteract tension stress produced from the chip carrier and adhesive in a molding process. This can effectively prevent the chip from cracking during molding, and thus improve the quality of fabricated products.
Huang, Chien-Ping. (2004). Semiconductor package with crack-preventing member (U.S. Patent No. 6707167). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6707167
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile