The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2002
Filed:
Aug. 03, 2001
Abstract
A fabricating method for a semiconductor package is proposed, in which a substrate module plate consisting of a plurality of array-arranged substrates is mounted with at least one chip on each of the substrates, so as to allow a heat sink module plate coated with an interface layer to attach to the chips. Subsequently, an encapsulant is formed by a molding compound for encapsulating the chip carrier module plate, the chips and the heat sink module plate during molding. As the adhesion between the interface layer and the encapsulant is smaller than that between the heat sink module plate and the encapsulant, the portion of the encapsulant formed on the interface layer can be easily removed without causing damage to the fabricated semiconductor package and delamination of the heat sink module plant from the encapsulant.