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Taichung, Taiwan

Tsung-Hsien Hsu

This inventor holds 4 USPTO granted patents. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2014-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung-Hsien Hsu. Retrieved from https://idiyas.com/inventor/tsung-hsien-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4

% Patents Active = 100.0

Average Co-Inventor Count = 4.1

ph-index = 2

Forward Citations = 11(Granted Patents)

Location History:

Taichung Hsien, TW (2014 - 2015)
Taichung, TW (2016)

Company Filing History:

Siliconware Precision Industries Co., Ltd.

Years Active: 2014-2016

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9490219 - Semiconductor package with shielding member and method of manufacturing the same (2016-11-08),

2. 9257394 - Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package (2016-02-09),

3. 8963299 - Semiconductor package and fabrication method thereof (2015-02-24),

4. 8766416 - Semiconductor package and fabrication method thereof (2014-07-01),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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