The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Jun. 17, 2013
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Kuang-Neng Chung, Taichung, TW;
Hsin-Lung Chung, Taichung, TW;
Tien-Chung Huang, Taichung, TW;
Tsung-Hsien Hsu, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate.