The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Oct. 25, 2012
Siliconware Precision Industries Co., Ltd., Taichung Hsien, TW;
Chien-Cheng Lin, Taichung Hsien, TW;
Tsung-Hsien Hsu, Taichung Hsien, TW;
Heng-Cheng Chu, Taichung Hsien, TW;
Chao-Ya Yang, Taichung Hsien, TW;
Chih-Ming Cheng, Taichung Hsien, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.