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Taichung, Taiwan

Heng-Cheng Chu

USPTO Granted Patents = 12 (Patent Applications = 2)

Average Co-Inventor Count = 4.9

ph-index = 2

Forward Citations = 14(Granted Patents)

Location History:

Taichung Hsien, TW (2015)
Taichung, TW (2012 - 2022)

Company Filing History:

Siliconware Precision Industries Co., Ltd.

Years Active: 2012-2022

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11476572 - Method for fabricating electronic package structure (2022-10-18),

2. 10587041 - Electronic package structure and fabrication method thereof (2020-03-10),

3. 10587037 - Electronic package structure (2020-03-10),

4. 10230152 - Electronic package and fabrication method thereof (2019-03-12),

5. 10199731 - Electronic component (2019-02-05),

6. 9997477 - Method of manufacturing semiconductor package (2018-06-12),

7. 9627748 - Electronic component (2017-04-18),

8. 9337250 - Semiconductor package and method of manufacturing the same (2016-05-10),

9. 8963299 - Semiconductor package and fabrication method thereof (2015-02-24),

10. 8962396 - Fabrication method of carrier-free semiconductor package (2015-02-24),

11. 8618655 - Carrier-free semiconductor package (2013-12-31),

12. 8264070 - Package structure with ESD and EMI preventing functions (2012-09-11),

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