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Heng-Cheng Chu

This inventor holds 12 USPTO granted patents and 2 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2012-2022.

USPTO Granted Patents = 12 (Patent Applications = 2)

% Patents Active = 100.0

Average Co-Inventor Count = 4.9

ph-index = 2

Forward Citations = 15(Granted Patents)

Location History:

Taichung Hsien, TW (2015)
Taichung, TW (2012 - 2022)

Company Filing History:

12 out of 826

Siliconware Precision Industries Co., Ltd.

patents

Years Active: 2012-2022

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11476572 - Method for fabricating electronic package structure (2022-10-18),

2. 10587041 - Electronic package structure and fabrication method thereof (2020-03-10),

3. 10587037 - Electronic package structure (2020-03-10),

4. 10230152 - Electronic package and fabrication method thereof (2019-03-12),

5. 10199731 - Electronic component (2019-02-05),

6. 9997477 - Method of manufacturing semiconductor package (2018-06-12),

7. 9627748 - Electronic component (2017-04-18),

8. 9337250 - Semiconductor package and method of manufacturing the same (2016-05-10),

9. 8963299 - Semiconductor package and fabrication method thereof (2015-02-24),

10. 8962396 - Fabrication method of carrier-free semiconductor package (2015-02-24),

11. 8618655 - Carrier-free semiconductor package (2013-12-31),

12. 8264070 - Package structure with ESD and EMI preventing functions (2012-09-11),

Title: Innovations by Heng-Cheng Chu

Introduction

Heng-Cheng Chu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 12 patents. His work focuses on developing innovative solutions that enhance the performance and miniaturization of electronic components.

Latest Patents

Among his latest patents is a method for fabricating an electronic package structure. This invention includes a substrate with an electronic component, an antenna element, and a shielding element. The shielding element is strategically positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI). Another notable patent is for an electronic package structure that features a substrate, a package encapsulant, and an antenna structure. This design allows for the miniaturization of the electronic package without the need to widen the substrate.

Career Highlights

Heng-Cheng Chu is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing electronic packaging technologies. His innovative approaches have garnered attention in the industry and contributed to the company's reputation for excellence.

Collaborations

Heng-Cheng has collaborated with several talented individuals, including Chih-Hsien Chiu and Chien-Cheng Lin. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Heng-Cheng Chu's contributions to electronic packaging through his patents and collaborations highlight his role as a leading inventor in the field. His innovative solutions continue to shape the future of electronic components and packaging technologies.

Profile summary based on public USPTO records.

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