The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2013
Filed:
May. 19, 2011
Ching-hua Chen, Taichung, TW;
Heng-cheng Chu, Taichung, TW;
Hsin-lung Chung, Taichung, TW;
Chih-hsien Chiu, Taichung, TW;
Chia-yang Chen, Taichung, TW;
Ching-Hua Chen, Taichung, TW;
Heng-Cheng Chu, Taichung, TW;
Hsin-Lung Chung, Taichung, TW;
Chih-Hsien Chiu, Taichung, TW;
Chia-Yang Chen, Taichung, TW;
Siliconware Precision Industries Co., Ltd, Taichung, TW;
Abstract
A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design.