The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2012
Filed:
Oct. 28, 2010
Tsung-hsien Tsai, Taichung, TW;
Heng-cheng Chu, Taichung, TW;
Hsin-lung Chung, Taichung, TW;
Chao-ya Yang, Taichung, TW;
Tsung-Hsien Tsai, Taichung, TW;
Heng-Cheng Chu, Taichung, TW;
Hsin-Lung Chung, Taichung, TW;
Chao-Ya Yang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A package structure with ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a carrier having first and second ground structures electrically insulated from one another; a semiconductor component disposed on one surface of the carrier and electrically connected to the first ground structure; and a lid member disposed to cover the carrier and the semiconductor component and electrically connected to the second ground structure. The semiconductor component and the lid member are electrically connected with the first ground structure and the second ground structure, respectively, such that electrostatic charges and electromagnetic waves can be conducted away individually without damaging the semiconductor component, thereby improving yield and reducing the risk of short circuits.