The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Dec. 05, 2013
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Chih-Hsien Chiu, Taichung, TW;

Heng-Cheng Chu, Taichung, TW;

Chien-Cheng Lin, Taichung, TW;

Tsung-Hsien Tsai, Taichung, TW;

Chao-Ya Yang, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 1/24 (2013.01); H01Q 1/52 (2013.01); H01L 23/552 (2013.01); H01Q 1/526 (2013.01); Y10T 29/49016 (2015.01);
Abstract

An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.


Find Patent Forward Citations

Loading…