The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Aug. 14, 2014
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Cho-Hsin Chang, Taichung, TW;
Tsung-Hsien Hsu, Taichung, TW;
Hsin-Lung Chung, Taichung, TW;
Te-Fang Chu, Taichung, TW;
Chia-Yang Chen, Taichung, TW;
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract
This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.