Kokubunji, Japan

Toru Fujioka


Average Co-Inventor Count = 4.2

ph-index = 7

Forward Citations = 254(Granted Patents)


Location History:

  • Kokubunji, JP (2002 - 2005)
  • Tokyo, JP (2008 - 2013)

Company Filing History:


Years Active: 2002-2013

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11 patents (USPTO):Explore Patents

Title: The Innovations of Toru Fujioka

Introduction

Toru Fujioka is a prominent inventor based in Kokubunji, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on enhancing the efficiency and miniaturization of RF power modules, particularly in mobile phone applications.

Latest Patents

One of his latest patents involves a semiconductor chip comprising a directional coupler with a specific main line and sub-line arrangement. This innovative technique promotes the miniaturization of RF power modules used in mobile phones. The directional coupler is formed within a semiconductor chip that includes an amplification part of the RF power module. A sub-line of the directional coupler is created in the same layer as a drain wire connected to the drain region of an LDMOSFET, which serves as the amplification component of the semiconductor chip. This design allows the predetermined drain wire to function as the main line, with the directional coupler configured by a sub-line arranged parallel to the main line through an insulating film.

Career Highlights

Throughout his career, Toru Fujioka has worked with notable companies such as Renesas Technology Corporation and Hitachi, Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Toru has collaborated with esteemed colleagues, including Isao Yoshida and Masatoshi Morikawa. Their joint efforts have further advanced the field of semiconductor technology.

Conclusion

Toru Fujioka's contributions to semiconductor technology and his innovative patents have significantly impacted the industry. His work continues to promote advancements in mobile technology and RF power modules.

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