Chiayi, Taiwan

Ting-Ying Shen

This inventor holds 16 USPTO granted patents and 1 published patent application and 2 EPO patents, primarily in Resistive Memory Technology. Top assignee: Winbond Electronics Corporation. Active years: 2015-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting-Ying Shen. Retrieved from https://idiyas.com/inventor/ting-ying-shen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 18(Granted Patents)


Location History:

  • Taichung, TW (2017 - 2021)
  • Chiayi, TW (2015 - 2022)

Company Filing History:


Years Active: 2015-2022

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Areas of Expertise:
Resistive Random Access Memory
Memory Devices
Semiconductor Fabrication
Non-Volatile Memory
Memory Circuit
Manufacturing Method
Memory Structure
Repairing Method
Resistive Memory
Device Fabrication
Semiconductor Devices
Memory Technology
16 patents (USPTO):Explore Patents

Title: Innovations of Inventor Ting-Ying Shen

Introduction

Ting-Ying Shen is a prominent inventor based in Chiayi, Taiwan. He has made significant contributions to the field of memory technology, particularly in resistive random access memory (RRAM). With a total of 16 patents to his name, Shen's work has advanced the capabilities and efficiency of memory storage solutions.

Latest Patents

Shen's latest patents include a resistive random access memory and its manufacturing method. This innovation features a substrate with an array region and a peripheral region, housing multiple memory cells and a gap-filling dielectric layer. The design incorporates a buffer layer in the array region, which is made from a different material than the gap-filling dielectric layer. Additionally, a first low-k dielectric layer is present in the peripheral region, with a dielectric constant of less than 3. Another notable patent is the RRAM structure, which consists of a bottom electrode layer, a resistance switching layer, and an implantation control layer. This structure is designed to enhance the performance and reliability of memory devices.

Career Highlights

Ting-Ying Shen is currently employed at Winbond Electronics Corporation, where he continues to innovate in the field of memory technology. His work has been instrumental in developing advanced memory solutions that meet the growing demands of modern computing.

Collaborations

Shen collaborates with talented coworkers, including Po-Yen Hsu and Bo-Lun Wu, who contribute to the innovative projects at Winbond Electronics Corporation.

Conclusion

Ting-Ying Shen's contributions to the field of resistive random access memory have positioned him as a key figure in memory technology innovation. His patents reflect a commitment to advancing the efficiency and effectiveness of memory storage solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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