Ting-Pang Chung

Title: Ting-Pang Chung: Innovator in Semiconductor Technology

Introduction

Ting-Pang Chung is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His innovative approaches have paved the way for advancements in semiconductor devices.

Latest Patents

One of Ting-Pang Chung's latest patents involves a method of forming a semiconductor device. This process begins with providing a substrate and forming a dielectric layer on it. Subsequently, at least one trench is created in the dielectric layer to partially expose the top surface of the substrate. The trench features a discontinuous sidewall with a turning portion. A first deposition process is then performed to deposit a first semiconductor layer, filling the trench and covering the top surface of the dielectric layer. Following this, the first semiconductor layer is laterally etched to partially remove it until the turning portion of the trench is exposed. Finally, a second deposition is conducted to deposit a second semiconductor layer to fill the trench.

Career Highlights

Ting-Pang Chung has worked with notable companies in the semiconductor industry, including United Microelectronics Corporation and Fujian Jinhua Integrated Circuit Co., Ltd. His experience in these organizations has contributed to his expertise and innovative capabilities in semiconductor technology.

Collaborations

Throughout his career, Ting-Pang Chung has collaborated with talented individuals such as Shu-Yen Chan and Chia-Wei Wu. These collaborations have fostered a creative environment that has led to significant advancements in their field.

Conclusion

Ting-Pang Chung is a distinguished inventor whose work in semiconductor technology has resulted in multiple patents and collaborations with industry leaders. His contributions continue to influence the development of innovative semiconductor devices.