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For the Inventor, By the Inventor

San Diego, CA, United States of America

Thomas Matthew Gregorich

USPTO Granted Patents = 15 

Average Co-Inventor Count = 2.6

ph-index = 4

Forward Citations = 40(Granted Patents)


Company Filing History:

goldMedal15 out of 4,773 
 
Mediatek Corporation
 patents

Years Active: 2013-2021

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15 patents (USPTO):Explore Patents
1. 11121108 - Flip chip package utilizing trace bump trace interconnection (2021-09-14),
2. 10707183 - Flip chip package utilizing trace bump trace interconnection (2020-07-07),
3. 10354970 - Flip chip package utilizing trace bump trace interconnection (2019-07-16),
4. 9659893 - Semiconductor package (2017-05-23),
5. 9640505 - Semiconductor package with trace covered by solder resist (2017-05-02),
6. 9437534 - Enhanced flip chip structure using copper column interconnect (2016-09-06),
7. 9437512 - Integrated circuit package structure (2016-09-06),
8. 9142526 - Semiconductor package with solder resist capped trace to prevent underfill delamination (2015-09-22),
9. 9064757 - Enhanced flip chip structure using copper column interconnect (2015-06-23),
10. 9040359 - Molded interposer package and method for fabricating the same (2015-05-26),
11. 8957518 - Molded interposer package and method for fabricating the same (2015-02-17),
12. 8859340 - Molded interposer package and method for fabricating the same (2014-10-14),
13. 8633588 - Semiconductor package (2014-01-21),
14. 8502377 - Package substrate for bump on trace interconnection (2013-08-06),
15. 8390119 - Flip chip package utilizing trace bump trace interconnection (2013-03-05),

Title: **Innovator Spotlight: Thomas Matthew Gregorich**

Introduction

Thomas Matthew Gregorich, an accomplished inventor based in San Diego, California, has made significant contributions to the field of technology. Holding 15 patents, his work focuses primarily on advancements in packaging technology, particularly relevant to the electronics industry. His innovative ideas have garnered attention and respect among his peers.

Latest Patents

Gregorich’s most recent patent, titled "Flip chip package utilizing trace bump trace interconnection," highlights his expertise in creating efficient packaging solutions for electronic components. This invention describes a flip chip package that features a substrate with a die attach surface. A die is mounted on this substrate, and crucially, it includes a stress buffering layer with specific openings to enhance electrical connections. Additionally, his other related patent focuses on the detailed application of copper pillar bumps that interact with the die in a sophisticated manner, showcasing Gregorich’s commitment to developing cutting-edge technology in the packaging sector.

Career Highlights

Currently working at MediaTek Corporation, Gregorich has established himself as a key player in the field of electronics. His extensive experience and innovative contributions reflect his dedication to advancing technology. Over the years, he has built a solid reputation for effectively addressing complex challenges in semiconductor packaging.

Collaborations

Throughout his career, Gregorich has collaborated with talented individuals like Tzu-Hung Lin and Ching-Liou Huang. These partnerships have paved the way for groundbreaking advancements in their field, showcasing the power of teamwork in driving innovation.

Conclusion

Thomas Matthew Gregorich is a distinguished inventor whose work in the electronics industry continues to influence modern technology. With his impressive portfolio of patents and collaborative spirit, he exemplifies the innovative drive that propels advancements in technology forward. His contributions are vital to the evolution of electronic packaging solutions, making him a notable figure in the realm of innovation.

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