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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9142526 B1

PDFFull Text
Date of Patent:
Sep. 22, 2015

Filed:

Dec. 11, 2013

Semiconductor package with solder resist capped trace to prevent underfill delamination

Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Tzu-Hung Lin, Zhubei, TW;

Ching-Liou Huang, Qionglin Township, Hsinchu County, TW;

Thomas Matthew Gregorich, San Diego, CA (US);

Assignee:

MEDIATEK INC., Hsin-Chu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Eva Y Montalvo

Assistant Examiner:

Grant Withers

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 21/563 (2013.01); H01L 23/3142 (2013.01); H01L 23/3157 (2013.01); H01L 23/49894 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83855 (2013.01);
Abstract

The invention provides a semiconductor package. The semiconductor package includes a substrate. A first conductive trace is disposed on the substrate. A first conductive trace disposed on the substrate. A semiconductor die is disposed over the first conductive trace. A solder resist layer that extends across an edge of the semiconductor die is also included. Finally, an underfill material is provided that fills a gap between the substrate and the semiconductor die.

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Lin, Tzu-Hung. (2015). Semiconductor package with solder resist capped trace to prevent underfill delamination (U.S. Patent No. 9142526). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9142526

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