The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Jan. 14, 2014
Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Thomas Matthew Gregorich, San Diego, CA (US);

Andrew C. Chang, Hsinchu, TW;

Tzu-Hung Lin, Zhubei, TW;

Assignee:

MediaTek Inc., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 23/52 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 23/49827 (2013.01); H01L 23/367 (2013.01); H01L 2924/19105 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15321 (2013.01); H01L 23/49816 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/1058 (2013.01); H01L 25/0657 (2013.01); H01L 2225/1041 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/1023 (2013.01); H01L 2224/81203 (2013.01); H01L 25/105 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/32245 (2013.01); H01L 25/0655 (2013.01); H01L 23/3128 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/16227 (2013.01); H01L 24/16 (2013.01); H01L 2224/81192 (2013.01);
Abstract

A method includes the operations performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet; mounting a carrier on the top surface of the metal sheet, covering the first recesses; performing a second anisotropic etching process to remove a portion of the metal sheet under the first recesses from the bottom surface of the metal sheet; filling a molding material from the bottom surface of the metal sheet, leaving the bottom surface of the metal sheet exposed; forming a passivation layer on the top surface of the metal sheet, having a plurality of openings therethrough; forming a plurality of first metal vias through the opening; and forming a solder mask layer on the passivation layer, leaving the first metal vias exposed.


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