The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
May. 19, 2011
Tzu-hung Lin, Hsinchu County, TW;
Ching-liou Huang, Hsinchu County, TW;
Thomas Matthew Gregorich, San Diego, CA (US);
Tzu-Hung Lin, Hsinchu County, TW;
Ching-Liou Huang, Hsinchu County, TW;
Thomas Matthew Gregorich, San Diego, CA (US);
Mediatek Inc., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A package substrate including a conductive pattern disposed on a die attach surface of the package substrate; at least one bumping trace inlaid into the conductive pattern; and at least one gap disposed along with the bumping trace in the conductive pattern to separate the bumping trace from a bulk portion of the conductive pattern. The bumping trace may have a lathy shape from a plan view and a width substantially between 10 μm and 40 μm and a length substantially between 70 μm and 130 μm, for example.