The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Dec. 21, 2011
Tzu-hung Lin, Zhubei, TW;
Ching-liou Huang, Qionglin Township, Hsinchu County, TW;
Thomas Matthew Gregorich, San Diego, CA (US);
Tzu-Hung Lin, Zhubei, TW;
Ching-Liou Huang, Qionglin Township, Hsinchu County, TW;
Thomas Matthew Gregorich, San Diego, CA (US);
Mediatek Inc., Hsin-Chu, TW;
Abstract
The invention provides a semiconductor package. The semiconductor package includes a substrate. A first conductive trace is disposed on the substrate. A solder resistance layer is disposed on the substrate, having an extending portion covering a portion of the first conductive trace, wherein a width of the extending portion of the solder resistance layer is larger than that of the portion of the first conductive trace. A semiconductor die is disposed over the first conductive trace.