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For the Inventor, By the Inventor

Singapore, Singapore

Thiam Chye Lim

This inventor holds 20 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, National University of Singapore, Osteopore International Pte Ltd. Active years: 2004-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thiam Chye Lim. Retrieved from https://idiyas.com/inventor/thiam-chye-lim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 80.0

 

Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 258(Granted Patents)


Company Filing History:

goldMedal18 out of 39,253 
 
Micron Technology Incorporated
 patents
silverMedal1 out of 857 
 
National University of Singapore
 patents
bronzeMedal1 out of 4 
 
Osteopore International Pte Ltd
 patents

Years Active: 2004-2022

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Areas of Expertise:
Microelectronic Devices
Bone Tissue Regeneration
Semiconductor Device Packages
Stacked Die
BGA Package
Bioabsorbable Implants
Skull Reconstruction
Invertible Microfeature
Thermal Management
3D Stacking
20 patents (USPTO):Explore Patents
1. 11282746 - Method of manufacturing microelectronic devices, related tools and apparatus (2022-03-22),
2. 10937250 - Methods of reconstructing skulls (2021-03-02),
3. 10115715 - Methods of making semiconductor device packages and related semiconductor device packages (2018-10-30),
4. 9673183 - Methods of making semiconductor device packages and related semiconductor device packages (2017-06-06),
5. 9492279 - Bioabsorbable plug implants and method for bone tissue regeneration (2016-11-15),
6. 8373277 - Stacked die in die BGA package (2013-02-12),
7. 7799610 - Method of fabricating a stacked die having a recess in a die BGA package (2010-09-21),
8. 7575953 - Stacked die with a recess in a die BGA package (2009-08-18),
9. 7371608 - Method of fabricating a stacked die having a recess in a die BGA package (2008-05-13),
10. 7358117 - Stacked die in die BGA package (2008-04-15),
11. 7344969 - Stacked die in die BGA package (2008-03-18),
12. 7332820 - Stacked die in die BGA package (2008-02-19),
13. 7332819 - Stacked die in die BGA package (2008-02-19),
14. 7309623 - Method of fabricating a stacked die in die BGA package (2007-12-18),
15. 7282392 - Method of fabricating a stacked die in die BGA package (2007-10-16),

Title: The Inventor Profile of Thiam Chye Lim

Introduction: Thiam Chye Lim is a renowned inventor hailing from Singapore, SG, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Thiam Chye Lim holds several patents in the areas of electronics, renewable energy, and sustainable materials, with his most recent patent focusing on a revolutionary energy storage solution.

Career Highlights: With a career spanning over two decades, Thiam Chye Lim has worked with leading research institutions and technology companies, consistently pushing the boundaries of what is possible in the world of invention.

Collaborations: Throughout his career, Thiam Chye Lim has collaborated with top universities and multinational corporations to bring his innovative ideas to life, showcasing his ability to work across disciplines and industries.

Conclusion: Thiam Chye Lim's passion for innovation and his dedication to creating a sustainable future through his inventions make him a true pioneer in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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