The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2007
Filed:
Aug. 29, 2006
Applicants:
Hock Chuan Tan, Singapore, SG;
Thiam Chye Lim, Singapore, SG;
Victor Cher Khng Tan, Singapore, SG;
Chee Peng Neo, Singapore, SG;
Michael Kian Shing Tan, Singapore, SG;
Beng Chye Chew, Singapore, SG;
Cheng Poh Pour, Singapore, SG;
Inventors:
Hock Chuan Tan, Singapore, SG;
Thiam Chye Lim, Singapore, SG;
Victor Cher Khng Tan, Singapore, SG;
Chee Peng Neo, Singapore, SG;
Michael Kian Shing Tan, Singapore, SG;
Beng Chye Chew, Singapore, SG;
Cheng Poh Pour, Singapore, SG;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.