Company Filing History:
Years Active: 2007-2013
Title: **Innovator Spotlight: Beng Chye Chew**
Introduction
Beng Chye Chew, an accomplished inventor from Singapore, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 12 patents, he is well-respected in his domain and continues to drive innovation at Micron Technology Incorporated.
Latest Patents
Among his latest patents, Beng Chye Chew has developed advanced solutions such as "Stacked die in die BGA package," which provides semiconductor devices and stacked die assemblies aimed at increasing semiconductor device density. Additionally, he holds a patent for the "Method of fabricating a stacked die having a recess in a die BGA package," further contributing to the fabrication processes of semiconductor devices and assemblies.
Career Highlights
Beng's career at Micron Technology Incorporated has been marked by a dedication to enhancing semiconductor technologies. His patents reflect an ongoing commitment to innovation and excellence in the field, solidifying his role as a key player in his company.
Collaborations
He has collaborated with esteemed colleagues such as Hock Chuan Tan and Chee Peng Neo, contributing to collective advancements in semiconductor manufacturing processes and technologies.
Conclusion
Beng Chye Chew’s work exemplifies the spirit of innovation that propels the semiconductor industry forward. Through his patents and collaborations at Micron Technology Incorporated, he continues to make a lasting impact in the realm of technology and invention.