The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Feb. 05, 2002
Hock Chuan Tan, Singapore, SG;
Thiam Chye Lim, Singapore, SG;
Victor Cher Khng Tan, Singapore, SG;
Chee Peng Neo, Singapore, SG;
Michael Kian Shing Tan, Singapore, SG;
Beng Chye Chew, Singapore, SG;
Cheng Poh Pour, Singapore, SG;
Hock Chuan Tan, Singapore, SG;
Thiam Chye Lim, Singapore, SG;
Victor Cher Khng Tan, Singapore, SG;
Chee Peng Neo, Singapore, SG;
Michael Kian Shing Tan, Singapore, SG;
Beng Chye Chew, Singapore, SG;
Cheng Poh Pour, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
Semiconductor devices and stacked die assemblies, are provided which have at least two semiconductor dies disposed on a substrate in a stacked arrangement, the first and second dies having first surfaces having bond pads, the second die having a second surface with a recessed edge portion along a perimeter of that die, and the recessed edge portion having a height sufficient for clearance of bonding elements extending from the first die.