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For the Inventor, By the Inventor

Singapore, Singapore

Chee Peng Neo

This inventor holds 18 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Semiconductor Components Industries, LLC. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chee Peng Neo. Retrieved from https://idiyas.com/inventor/chee-peng-neo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 66.7

Average Co-Inventor Count = 4.9

ph-index = 6

Forward Citations = 105(Granted Patents)


Company Filing History:

goldMedal17 out of 39,253 
 
Micron Technology Incorporated
 patents
silverMedal1 out of 3,733 
 
Semiconductor Components Industries, LLC
 patents

Years Active: 2004-2026

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Areas of Expertise:
Image Sensor Packaging
Semiconductor Workpiece Carriers
Stacked Die BGA Package
Microelectronic Component Assemblies
Lead Frames
Topographical Features
Die Fabrication
Recess Design
Die Packaging
Processing Methods
Semiconductor Technologies
Microelectronic Substrates
18 patents (USPTO):Explore Patents
1. 12532559 - Image sensor packaging structures and related methods (2026-01-20),
2. 8476109 - Semiconductor workpiece carriers and methods for processing semiconductor workpieces (2013-07-02),
3. 8373277 - Stacked die in die BGA package (2013-02-12),
4. 8011513 - Semiconductor workpiece carriers and methods for processing semiconductor workpieces (2011-09-06),
5. 7799610 - Method of fabricating a stacked die having a recess in a die BGA package (2010-09-21),
6. 7691680 - Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths (2010-04-06),
7. 7575953 - Stacked die with a recess in a die BGA package (2009-08-18),
8. 7371608 - Method of fabricating a stacked die having a recess in a die BGA package (2008-05-13),
9. 7358117 - Stacked die in die BGA package (2008-04-15),
10. 7344969 - Stacked die in die BGA package (2008-03-18),
11. 7332820 - Stacked die in die BGA package (2008-02-19),
12. 7332819 - Stacked die in die BGA package (2008-02-19),
13. 7309623 - Method of fabricating a stacked die in die BGA package (2007-12-18),
14. 7282392 - Method of fabricating a stacked die in die BGA package (2007-10-16),
15. 7282390 - Stacked die-in-die BGA package with die having a recess (2007-10-16),

Title: Chee Peng Neo: Innovator in Semiconductor Technology

Introduction

Chee Peng Neo is a prominent inventor based in Singapore, known for his significant contributions to semiconductor technology. With a total of 17 patents to his name, he has made remarkable advancements in the field, particularly in the design and processing of semiconductor workpieces.

Latest Patents

Among his latest patents are innovative solutions such as semiconductor workpiece carriers and methods for processing semiconductor workpieces. This patent describes a semiconductor workpiece carrier assembly that includes a support structure with an opening designed to receive a portion of a semiconductor workpiece. The assembly features a replaceable carrier that consists of a base and an adhesive layer, which allows for easy attachment and detachment from the support structure. Another notable patent involves stacked die in die BGA packages, which focuses on semiconductor devices and stacked die assemblies. This invention aims to enhance semiconductor device density through advanced fabrication methods.

Career Highlights

Chee Peng Neo has established a successful career at Micron Technology Incorporated, where he continues to innovate and develop cutting-edge semiconductor technologies. His work has not only contributed to the company's success but has also advanced the semiconductor industry as a whole.

Collaborations

Throughout his career, Chee has collaborated with talented individuals such as Hock Chuan Tan and Beng Chye Chew, further enhancing the innovative environment at Micron Technology.

Conclusion

Chee Peng Neo's contributions to semiconductor technology exemplify his dedication to innovation and excellence. His patents and collaborative efforts continue to shape the future of the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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