The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
May. 23, 2017
Micron Technology, Inc., Boise, ID (US);
Thiam Chye Lim, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods of fabricating a semiconductor device package may involve providing a fan out wafer including semiconductor-device-package locations at a base level. Laterally offset semiconductor dice may be stacked at least some semiconductor-device-package locations of the fan out wafer to expose bond pads at a lateral periphery of each of the laterally offset semiconductor dice. The laterally offset semiconductor dice may be electrically connected to one another and associated electrically conductive traces of the at least some semiconductor-device-package locations. The semiconductor-device-package locations having stacks of semiconductor dice thereon may be singulated from the fan out wafer.