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Tetsuya Kurosawa

This inventor holds 34 USPTO granted patents and 1 EPO patent, primarily in Semiconductor Devices. Top assignees: Kabushiki Kaisha Toshiba, Lintec Corporation. Active years: 2001-2019.

USPTO Granted Patents = 34

% Patents Active = 70.6

EPO Patents = 1

Average Co-Inventor Count = 2.2

ph-index = 10

Forward Citations = 335(Granted Patents)

Location History:

Kawasaki, JP (2002 - 2004)
Kanagawa-Ken, JP (2007)
Yokohama, JP (2001 - 2015)
Yokkaichi Mie, JP (2018)
Kanagawa, JP (2006 - 2019)

Company Filing History:

34 out of 53,240

Kabushiki Kaisha Toshiba

where one patent can have more than one assignee

Years Active: 2001-2019

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Areas of Expertise:

Semiconductor Device

Stacked Semiconductor Package

Wafer Dividing Method

Adhesive Sheet

Manufacturing Method

Semiconductor Chips

Peeling Mechanism

Chip Pickup Device

Semiconductor Manufacturing Equipment

Roughened Surface

Resin Package

Cleaving Apparatus

34 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10490485 - Semiconductor device (2019-11-26),

2. 10026677 - Semiconductor device (2018-07-17),

3. 9887311 - Semiconductor module having a light-transmissive insulating body (2018-02-06),

4. 8956917 - Semiconductor device, and manufacturing method and manufacturing apparatus of the same (2015-02-17),

5. 8294282 - Semiconductor device and adhesive sheet (2012-10-23),

6. 7932162 - Method for manufacturing a stacked semiconductor package, and stacked semiconductor package (2011-04-26),

7. 7892890 - Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof (2011-02-22),

8. 7675153 - Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof (2010-03-09),

9. 7642113 - Semiconductor wafer dividing method (2010-01-05),

10. 7638858 - Semiconductor device and manufacturing method thereof (2009-12-29),

11. 7631680 - Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer (2009-12-15),

12. 7608911 - Semiconductor device package having a semiconductor element with a roughened surface (2009-10-27),

13. 7405159 - Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface (2008-07-29),

14. 7300818 - Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer (2007-11-27),

15. 7294558 - Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid (2007-11-13),

Title: Tetsuya Kurosawa: Pioneering Inventor from Yokohama

Introduction: Tetsuya Kurosawa is a renowned inventor hailing from Yokohama, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Tetsuya Kurosawa holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his innovative spirit and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Kurosawa has worked with leading research institutions and tech companies, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Tetsuya Kurosawa has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Tetsuya Kurosawa's relentless pursuit of innovation and his passion for creating solutions to complex problems have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.

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