The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2012

Filed:

Mar. 23, 2010
Applicants:

Hidekazu Hayashi, Yokohama, JP;

Hiroshi Tomita, Yokohama, JP;

Junya Sagara, Kawasaki, JP;

Shinya Takyu, Saitama-Ken, JP;

Norihiro Togasaki, Yokohama, JP;

Tetsuya Kurosawa, Yokohama, JP;

Yukiko Kitajima, Yokohama, JP;

Inventors:

Hidekazu Hayashi, Yokohama, JP;

Hiroshi Tomita, Yokohama, JP;

Junya Sagara, Kawasaki, JP;

Shinya Takyu, Saitama-Ken, JP;

Norihiro Togasaki, Yokohama, JP;

Tetsuya Kurosawa, Yokohama, JP;

Yukiko Kitajima, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/28 (2006.01); H01L 23/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a semiconductor device which comprises a substrate, a first semiconductor chip on a substrate, a second semiconductor chip on the first semiconductor chip, and an adhesive sheet between the first and second semiconductor chips. The second semiconductor chip has a mirrored back surface, and the adhesive sheet contains a metal impurity ion trapping agent.


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