The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
Mar. 07, 2005
Applicants:
Noriko Shimizu, Yokohama, JP;
Shinya Takyu, Kitakatsushika-gun, JP;
Tetsuya Kurosawa, Yokohama, JP;
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); B26B 7/10 (2006.01); B26F 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A starting point for cleavage made up of at least one of a groove and a through hole is formed on a chip dividing line or a dicing line along the cleaved surface of a wafer. Liquid matter is injected into the starting point. Then, the liquid matter is changed by applying an external factor that changes the liquid matter physically. Making use of the change, the wafer is cleaved so as to divide the wafer into semiconductor chips.
Shimizu, Noriko. (2007). Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid (U.S. Patent No. 7294558). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7294558
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile