The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Aug. 30, 2016
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Tetsuya Kurosawa, Yokkaichi Mie, JP;

Yoshihisa Imori, Yokohama Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/173 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 31/054 (2014.01); H01L 31/048 (2014.01);
U.S. Cl.
CPC ...
H01L 31/173 (2013.01); H01L 31/0481 (2013.01); H01L 31/0547 (2014.12); H01L 33/56 (2013.01); H01L 33/62 (2013.01);
Abstract

A semiconductor module includes a light emitting element, a semiconductor element including a light receptor circuit disposed to receive light from the light emitting element, a light-transmissive insulating body disposed between the light emitting element and the semiconductor element, at least one of a first surface thereof facing the semiconductor element and a second surface thereof facing the light emitting element including a ragged region, a first light-transmissive bonding resin formed between the light emitting element and the light-transmissive insulating body, and a second light-transmissive bonding resin formed between the semiconductor element and the light-transmissive insulating body.


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