Ibaraki, Japan

Terumasa Moriyama

USPTO Granted Patents = 7 


Average Co-Inventor Count = 1.9

ph-index = 3

Forward Citations = 24(Granted Patents)


Company Filing History:


Years Active: 2012-2022

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7 patents (USPTO):Explore Patents

Title: Innovations by Terumasa Moriyama: Advancements in Copper Foil Technology

Introduction

Terumasa Moriyama, an accomplished inventor based in Ibaraki, Japan, has made significant contributions to the field of materials science, particularly in the development of copper foil technologies. With a portfolio comprising seven patents, Moriyama is recognized for his innovative approaches in enhancing the performance of electronic components.

Latest Patents

Among his latest inventions are several noteworthy patents that focus on improving the characteristics of copper foil used in high-frequency circuit boards. His notable patents include technologies for a surface-treated copper foil, copper foil with a carrier, laminated materials, and methods for producing printed wiring boards and electronic apparatuses. One of his groundbreaking innovations is the surface-treated copper foil designed to reduce transmission loss effectively, while also offering improved acid resistance. This advanced copper foil features a surface treatment layer incorporating a roughening treatment and includes a specific nickel content, which enhances its performance in electronic applications.

Career Highlights

Moriyama is affiliated with JX Nippon Mining & Metals Corporation, where he leverages his expertise to drive innovations in electronic materials. His role in the company exemplifies his commitment to advancing technologies that meet the growing demands of high-performance electronics.

Collaborations

Throughout his career, Moriyama has collaborated with talented coworkers, including Tomota Nagaura and Michiya Kohiki. Their collective efforts have significantly contributed to the successful development and commercialization of new copper foil technologies.

Conclusion

Terumasa Moriyama's dedication to innovation in the field of electronic materials is reflected in his substantial patent portfolio and impactful contributions to the industry. His work not only enhances the functionality of electronic devices but also paves the way for future advancements in technology. As he continues to evolve in his field, Moriyama remains a prominent figure in driving innovations within the realm of copper foil applications.

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