The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Feb. 05, 2018
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Terumasa Moriyama, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/02 (2006.01); H05K 3/28 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); C23F 1/18 (2006.01); C25D 5/14 (2006.01); C25D 3/04 (2006.01); C25D 5/48 (2006.01); H05K 3/20 (2006.01); C25D 7/06 (2006.01); C23F 1/14 (2006.01); C25D 9/08 (2006.01); C25D 5/00 (2006.01); C25D 3/38 (2006.01); H05K 3/10 (2006.01); H05K 3/06 (2006.01); C25D 3/12 (2006.01); C23C 22/24 (2006.01); H05K 1/02 (2006.01); C25D 3/56 (2006.01); C23F 4/00 (2006.01);
U.S. Cl.
CPC ...
C23F 1/02 (2013.01); C23F 1/14 (2013.01); C23F 1/18 (2013.01); C25D 3/04 (2013.01); C25D 5/14 (2013.01); C25D 5/48 (2013.01); C25D 5/605 (2020.08); C25D 7/0614 (2013.01); C25D 9/08 (2013.01); H05K 1/09 (2013.01); H05K 3/205 (2013.01); H05K 3/28 (2013.01); H05K 3/4652 (2013.01); C23C 22/24 (2013.01); C23C 2222/20 (2013.01); C23F 4/00 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 3/562 (2013.01); H05K 1/0242 (2013.01); H05K 3/06 (2013.01); H05K 3/108 (2013.01); H05K 3/4682 (2013.01); H05K 2201/0367 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/1311 (2013.01);
Abstract
To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.