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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11401612 B1

PDFFull Text
Date of Patent:
Aug. 02, 2022

Filed:

Feb. 05, 2018

Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus

Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Terumasa Moriyama, Ibaraki, JP;

Assignee:

JX Nippon Mining & Metals Corporation, Tokyo, JP;

Attorney:

Nields, Lemack & Frame, LLC

Primary Examiner:

Nicholas R Krasnow

Int. Cl.
CPC ...
C23F 1/02 (2006.01); H05K 3/28 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); C23F 1/18 (2006.01); C25D 5/14 (2006.01); C25D 3/04 (2006.01); C25D 5/48 (2006.01); H05K 3/20 (2006.01); C25D 7/06 (2006.01); C23F 1/14 (2006.01); C25D 9/08 (2006.01); C25D 5/00 (2006.01); C25D 3/38 (2006.01); H05K 3/10 (2006.01); H05K 3/06 (2006.01); C25D 3/12 (2006.01); C23C 22/24 (2006.01); H05K 1/02 (2006.01); C25D 3/56 (2006.01); C23F 4/00 (2006.01);
U.S. Cl.
CPC ...
C23F 1/02 (2013.01); C23F 1/14 (2013.01); C23F 1/18 (2013.01); C25D 3/04 (2013.01); C25D 5/14 (2013.01); C25D 5/48 (2013.01); C25D 5/605 (2020.08); C25D 7/0614 (2013.01); C25D 9/08 (2013.01); H05K 1/09 (2013.01); H05K 3/205 (2013.01); H05K 3/28 (2013.01); H05K 3/4652 (2013.01); C23C 22/24 (2013.01); C23C 2222/20 (2013.01); C23F 4/00 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 3/562 (2013.01); H05K 1/0242 (2013.01); H05K 3/06 (2013.01); H05K 3/108 (2013.01); H05K 3/4682 (2013.01); H05K 2201/0367 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/1311 (2013.01);
Abstract

To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

Find Patent Forward Citations

Moriyama, Terumasa. (2022). Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus (U.S. Patent No. 11401612). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11401612

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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