The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Jul. 25, 2016
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventors:
Terumasa Moriyama, Ibaraki, JP;
Tomota Nagaura, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 37/00 (2006.01); H01L 21/48 (2006.01); C25D 1/04 (2006.01); H05K 3/02 (2006.01); H05K 3/20 (2006.01); H01L 23/498 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); C25D 3/18 (2006.01); C25D 3/38 (2006.01); C25D 3/56 (2006.01); C25D 3/58 (2006.01); C25D 5/02 (2006.01); C25D 5/10 (2006.01); C25D 9/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); C25D 1/04 (2013.01); H01L 21/486 (2013.01); H01L 23/49866 (2013.01); H05K 3/025 (2013.01); H05K 3/205 (2013.01); C25D 3/18 (2013.01); C25D 3/38 (2013.01); C25D 3/562 (2013.01); C25D 3/58 (2013.01); C25D 5/022 (2013.01); C25D 5/10 (2013.01); C25D 9/08 (2013.01); H05K 3/4007 (2013.01); H05K 3/421 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0726 (2013.01); Y10T 428/12431 (2015.01); Y10T 428/12438 (2015.01); Y10T 428/12472 (2015.01);
Abstract
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.