The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Jul. 25, 2016
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventors:
Terumasa Moriyama, Ibaraki, JP;
Tomota Nagaura, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 37/00 (2006.01); H05K 3/46 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4652 (2013.01); H05K 1/09 (2013.01); H05K 3/4682 (2013.01); H05K 3/007 (2013.01); H05K 3/025 (2013.01); H05K 3/4007 (2013.01); Y10T 428/12431 (2015.01); Y10T 428/12438 (2015.01);
Abstract
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5 grains/μm, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.