The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
May. 29, 2009
Terumasa Moriyama, Ibaraki, JP;
Kengo Kaminaga, Ibaraki, JP;
Terumasa Moriyama, Ibaraki, JP;
Kengo Kaminaga, Ibaraki, JP;
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Abstract
Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a 'nickel zinc layer') on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180 μg/dmor more and 3500 μg/dmor less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight/(nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.