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For the Inventor, By the Inventor

Hudson, MA, United States of America

Tejpal Singh

This inventor holds 11 USPTO granted patents and 1 published patent application. Top assignee: Intel Corporation. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tejpal Singh. Retrieved from https://idiyas.com/inventor/tejpal-singh-674k7rc4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 90.9

Average Co-Inventor Count = 8.7

ph-index = 1

Forward Citations = 10(Granted Patents)


Location History:

  • Shrewsbury, MA (US) (2019 - 2023)
  • Hudson, MA (US) (2017 - 2024)

Company Filing History:

goldMedal11 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2017-2026

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11 patents (USPTO):Explore Patents
1. 12599033 - Quasi-monolithic integrated packaging architecture with mid-die serializer/deserializer (2026-04-07),
2. 11899615 - Multiple dies hardware processors and methods (2024-02-13),
3. 11734174 - Low overhead, high bandwidth re-configurable interconnect apparatus and method (2023-08-22),
4. 11586579 - Multiple dies hardware processors and methods (2023-02-21),
5. 11336559 - Fast-lane routing for multi-chip packages (2022-05-17),
6. 11294852 - Multiple dies hardware processors and methods (2022-04-05),
7. 11294850 - System, apparatus and method for increasing bandwidth of edge-located agents of an integrated circuit (2022-04-05),
8. 11256657 - System, apparatus and method for adaptive interconnect routing (2022-02-22),
9. 10795853 - Multiple dies hardware processors and methods (2020-10-06),
10. 10193826 - Shared mesh (2019-01-29),
11. 9698781 - Dynamic clock gating frequency scaling (2017-07-04),

Title: Tejpal Singh: Innovator in Hardware Processor Technologies

Introduction

Tejpal Singh is a prominent inventor based in Hudson, MA, known for his significant contributions to hardware processor technologies. With a total of 10 patents to his name, Singh has made remarkable advancements in the field of interconnected hardware processors.

Latest Patents

Singh's latest patents include innovative methods and apparatuses relating to hardware processors with multiple interconnected dies. One embodiment describes a hardware processor that consists of a plurality of physically separate dies, which are electrically coupled together through an interconnect. Another notable patent focuses on a low overhead, high bandwidth re-configurable interconnect apparatus and method. This invention allows for the reconfiguration of buffered interconnect links to operate in various modes, including bandwidth mode, latency mode, and energy mode, optimizing performance and energy consumption.

Career Highlights

Tejpal Singh is currently employed at Intel Corporation, where he continues to push the boundaries of technology. His work has been instrumental in developing advanced hardware solutions that enhance processing capabilities and efficiency.

Collaborations

Singh has collaborated with notable colleagues, including Yen-Cheng Liu and Krishnakanth Venkata Sistla, contributing to a dynamic and innovative work environment.

Conclusion

Tejpal Singh's contributions to hardware processor technologies exemplify his dedication to innovation and excellence in engineering. His patents reflect a deep understanding of complex systems and a commitment to advancing technology for future applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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