The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Aug. 21, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Adel A. Elsherbini, Chandler, AZ (US);

Tejpal Singh, Shrewsbury, MA (US);

Shawna M. Liff, Scottsdale, AZ (US);

Gerald S. Pasdast, San Jose, CA (US);

Johanna M. Swan, Scottsdale, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 45/122 (2022.01); H04L 45/12 (2022.01); H04L 9/40 (2022.01); G06F 12/0842 (2016.01); H04L 49/109 (2022.01);
U.S. Cl.
CPC ...
H04L 45/122 (2013.01); G06F 12/0842 (2013.01); H04L 29/06 (2013.01); H04L 45/126 (2013.01); H04L 49/109 (2013.01);
Abstract

Embodiments herein may relate to a processor package with a substrate and a multi-chip processor coupled with the substrate. The multi-chip processor may include a dual-sided interconnect structure coupled with a first chip, a second chip, and a third chip. The first chip may be communicatively coupled with the second chip by an on-chip communication route. Likewise, the second chip may be communicatively coupled with the first chip by an on-chip communication route. Additionally, the first chip may be communicatively coupled with the third chip by a fast-lane communication route. Other embodiments may be described and/or claimed.


Find Patent Forward Citations

Loading…